As to thermal management, we offer the entire spectrum of a full-service provider:
From the analysis of technical and basically realizable possibilities to physical analysis. The latter ensures that the function of the display or the embedded display application is given despite the waste heat from the planned design included its plugged elements. Therefore, the analysis is put to customer requests to investigate the cause of failure and to show possibilities in order to improve the display device, also within the given concept.
Similar to optical bonding, single analysis can be carried out just as well as shown improvements measures can be fully implemented – also for displays and devices of third parties.